Different sfp board compatibility for mobile

 H801SPUF Board

The H801SPUF board is a multifunctional service processing board, expanding ARP and ND entries and route entries and enhancing Layer 3 forwarding capabilities.

 Feature and Specifications

Comparison Between SPU Service Processing Boards

For the functions and specifications supported by the H801SPUB board, see . The following table lists the functions and specifications supported by other SPU service processing boards.

In the following table, "Yes" indicates "supported" and "No" indicates "not supported".

Table 1 Functions and specifications of SPU service processing boards

 Parameters

Power Consumption and Maximum Frame Size of Boards

You can query power consumption, maximum frame size, and normal operating temperature of all boards.

 lists the power consumption and maximum frame size of boards. "-" indicates N/A.

The operating temperature of all the boards is -40°C to +65°C. The lowest board startup temperature is -25°C.

 NOTE:

The power consumption of the board is tested in the following conditions:

Working voltage: -53.5 V DC.

Ambient temperature: 25 °C.

Static power consumption: All ports do not carry any loads. Specifically, users under POTS ports hang up phones, xDSL ports are deactivated, and optical modules are not installed on optical ports

Maximum power consumption: All ports fully carry loads. However, only 25% users under POTS ports concurrently pick up phones and the feeding current is 20 mA.

The board power consumption slightly varies with the power module configured for the board and discreteness of components.

Table 1 Power consumption and maximum frame size of boards